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but to specify the test method to be used when testing for parameters covered by this Test Method
Process and quality control during manufacturing of wafers requires continuous monitoring of waviness with a noncontact method that supports high throughput
but that is beyond the scope of this Standard
1-1104 (Reapproved 0723)
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages StdTpc-Silicon Materials & Process Control but to specify the testThis specification is a guideline for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers. Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Material SEMI G10 Standard Method of Mechanical Measurement for Leadframes
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